ESD Sensitivity of Precision Chip Resistors Comparison between Foil and Thin Film Chips
نویسنده
چکیده
The sensitivity level of resistors used in electronic equipment to an electrostatic discharge (ESD) varies from a few hundred volts to a few tens of kilovolts. Ways to make resistors more robust to ESD are suggested. The influence on ESD robustness of resistive element's size, resistive pattern design and ohmic value is discussed. Foil and thin film technologies are compared. In order to test the capability of high precision resistor chips to withstand high voltage ESD, samples were chosen from Bulk Metal® Foil technology and two types of Thin Film material nickel-chrome alloy and Tantalum nitride. identically sized chips of two ohmic values 30 Ω and 1 kΩ were tested. All samples underwent ESD pulses ranging from 2 kV to 24 kV. Test results indicated two orders of magnitude superior stability of Foil chips over Thin Film chips when subjected to high voltage ESD, for both ohmic values. This superiority is attributed mainly to lower temperature rise due to the much larger thickness and therefore heat capacity of the resistive Foil layer compared to Thin Films.
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